Sony has made a few changes to the core hardware of the PS3 that should hopefully get them closer to the hardware break even point.
The Reality Synthesizer (RSX) Graphics Processing Unit (GPU) has seen some changes during the PS3 life-cycle. Initially it was 90nm during launch, later it was reduced to 65nm, and now another change to 40nm. Reducing the chipset is not only inline with industry reductions of larger chips, but it also serves to reduce power consumption and heat which is crucial in a relatively tight space. To date the PS3 Slim units have not experienced the YLOD (yellow light of death) in mass quantities, and this revision should help to reduce that phenomenon.
This new version CECH-2100A contains a few other changes as well. The power supply weighs less, the heatsink is more simple,the internal cooling unit is much smaller as well resulting in an overall lighter console. Further the XD DRAM configuration was changed from being 4x512Mb to 2x1Gb. This is very similar to the future layout that Goto-san described back in 2006.
PocketNews performed the tear down and examination of the system. They also took a look at power consumption and how it relates to the new version:
| Model Name | CECH-2000A | CECH-2100A |
| XMB Menu (Still wallpapers) | 76W | 67W |
| XMB Menu (Main Theme) | 83-86W | 71W |
| Top Menu torne | 92-93W | 76-77W |
| torne program recording and viewing | 84-87W | 73W |
| FFXIII Cut Scene | 96-107W | 78-83W |
| FFXIII Game Menu | 83-84W | 74W |
| BD playback | 88-91W | 77-78W |
| Power Off – Remote Play Standby | 9W | 9W |
While it’s not currently available in the US yet, Amazon.co.jp has it available. Lower power consumption, less heat and cheaper manufacturing costs is a win for everyone.
Images courtesy of PocketNews
